Smart terminals · Smart POS and IoT devices

Key components at the assembly stage have to be bound

Unit assembly, many models, medium volume and a high share of outsourced parts. The question asked most often during repair is which batch of displays and mainboards is inside this machine.

Missing key-component bindings are prevented by a station that cannot be passed without a scan, not by memory.

Background

Unit assembly with frequent model changes

The product line is mainly smart POS and IoT terminals, and the same line switches between several models. Displays, mainboards and batteries come from different suppliers, so batches change quickly.

Outsourced parts go straight onto the line, and key-component batches arrive with the goods from the supplier. Nothing is registered again in-house, so when a unit is opened for repair the origin can only be judged from appearance and labels.

Problems

Three problems that all come down to binding

The difficulty in assembly traceability is not the volume of records but how often those few key-component scans actually happen.

  1. 01

    Key components left unbound

    Scanning depends on the operator remembering; under pressure only the unit SN is scanned. After a repair teardown the system has no batch for that display.

  2. 02

    Test data in inconsistent formats

    Several test machines from different vendors use different parameters and units, so alignment is manual at summary time.

  3. 03

    Wrong accessories only found by the customer

    Packing accessories are checked by hand against the model list; a missing or extra piece usually surfaces when the customer opens the carton.

Scope

Assembly, test and packaging

No full module roll-out. Key-component binding and test-data collection come first, and the packaging stage joins with outbound verification.

Process stage

  • Assembly
  • Test
  • Packaging

Modules in use

  • Assembly process traceability
  • Test parameter traceability
  • Packaging traceability

View all 15 modules

Approach

No scan, no pass

Binding is made a precondition for passing a station rather than a form filled in afterwards.

  1. 01

    Fix the key-component list first

    Display, mainboard, battery and camera are classed as key components, and each binds to the SN. The list is configured in the system and maintained from the BOM when a model is added.

  2. 02

    Binding as a condition for passing

    For an SN whose key components are unbound, the next scan reports an error and locks the station; binding has to be completed to continue. Missing bindings no longer depend on a team leader's spot check.

  3. 03

    Unified test parameters

    Common parameter names and units are defined with the customer, and each test machine maps to them through an interface, filed by SN.

  4. 04

    Check the packaging list item by item

    Before sealing, every accessory on the model BOM is scanned and confirmed; a missing or extra piece blocks sealing.

Results

Findable during repair and complaints

Once key-component binding and test-data collection were in place, two high-frequency situations changed.

  1. Key-component batches listed by SN

    Before a teardown the system is checked first: which batch that display and mainboard came from is answered directly.

  2. Test parameters correspond one-to-one with the SN

    Test data from different batches of the same model can be compared, and the parameter where anomalies concentrate becomes visible.

  3. Wrong accessories stopped before sealing

    A carton cannot be sealed until the list check passes, so wrong configurations do not leave the plant.

Similar projects

Settle the key-component list before discussing binding

Which parts count as key components and which level they bind to has to be decided before the project starts.

Address
Building 8, Room 303, Yilisheng Industrial Park, 602 Fengtang Avenue, Tangwei Community, Fuhai Street, Bao'an District, Shenzhen

Shenzhen Baichuan Zhike Technology Co., Ltd. · Since 2015 , serving electronics manufacturers across handsets, tablets, automotive electronics, FPC, WiFi modules, energy storage and more.

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